dimensions general specifications chip terminations 50 alumina terminations alumina chip terminations features dc - 6.0 ghz 10-40 watts low cost alumina ceramic non-nichrome resistive element low vswr 100% tested ? 1 sales desk usa: v oice: (800) 544-2414 fax: (315) 432-9121 sales desk europe: v oice: (+44) 23 92 232392 fax: (+44) 23 92 251369 a vailable on tape and reel for pick and place manufacturing. note: see table for dimensions. preliminar preliminar y y pa rt number width length thk. a rfp-060120a25x50 0.060 0.120 0.025 0.030 rfp-100200a25x50 0.100 0.200 0.025 0.030 rfp-250250a4x50 0.250 0.250 0.040 0.040 rfp-250375a4x50 0.250 0.375 0.040 0.040 RFP-375250A4X50 0.375 0.250 0.040 0.050 rfp-375375a4x50 0.375 0.375 0.040 0.050 resistive element: thick film substrate: alumina ceramic t erminals: thick film silver resistance value: 50 ohms, 2% notes: t olerance is .010, unless otherwise specified. operating temperature is -55? to +125? (see chart). designed to meet or exceed applicable portions of mil-e-5400. all dimensions are in inches. specifications subject to change without notice. outline drawing ver. 12/5/01
alumina chip terminations alumina terminations 2 sales desk usa: v oice: (800) 544-2414 fax: (315) 432-9121 sales desk europe: v oice: (+44) 23 92 232392 fax: (+44) 23 92 251369 suggested mounting procedures board higher than lead. board lower than lead. scale: not recommended application a vailable on tape and reel for pick and place manufacturing. t ypical performance preliminar preliminar y y pa rt number value (ohm) power (watts) max vswr freq. (ghz) rfp-060120a25x50 50 10 1.25:1 6.0 rfp-100200a25x50 50 20 1.25:1 6.0 rfp-250250a4x50 50 30 1.25:1 3.0 rfp-250375a4x50 50 40 1.25:1 3.0 RFP-375250A4X50 50 40 1.20:1 2.5 rfp-375375a4x50 50 40 1.20:1 2.5 power derating 100 125 100 75 50 25 50 0 25 heat sink temperature ? c 75 % of rated power min. scale: with lead. board even .025 board lower than lead. suggested stress relief methods (2 places) 1. make sure that the devices are mounted on flat surfaces (.001?under the device) to optimize the heat transfer. 2. position device on mounting surface and solder in place using an indalloy type or an sn63 type solder. 3. solder leads in place using a 60/40 type solder with a controlled temperature iron (700?).
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